GPC Electronics operates SMT equipment for both high volume and high mix assembly.

SMT capability

• RoHS compliant?   Yes
• High Volume          Up to 5M placements per day
• High mix                  Up to 12 changeovers per day per line 
                                    (What does this mean for you?)

• Component Technologies
• BGA: Up to 1500 pins
• microBGA
• Fine pitch: 300 micron (0.012 in)
• Largest component:  55 x 55 mm
• Chip components: 0402, 0201
• Max PCB panel size: 460 x 460 mm
• Flexible PCBs:    Yes

 SMT Equipment

• Siemens Siplace S15
• Siemens Siplace S20
• Mydata MY19
• Mydata MY12
• Mydata M9